Remote spots: Static units are usually positioned remotely, raising Expense and decreasing In general program effectiveness.

Software & TCU software package calibration strategies change external take a look at here machines not utilised on a regular basis for verifying

Together with the POU3500, you'll be able to obtain unparalleled leads to etch general performance, chamber uptime, decreased price of ownership and fab Place utilization – all when bettering your approach trustworthiness.

Originally Launched in 1985, our company has developed into a recognized leader in delivering temperature control systems to the global semiconductor business.

This impressive method, providing a little form issue, low priced-of-Ownership and Dynamic Temperature Management available system and devices engineers a whole new Software to enhance their temperature delicate procedures.

we've been guided in our perception that prosperity Within this competitive sector stems from delivering shoppers with highly engineered new goods and environment course customer care.

The accuracy of the POU 3500 allows for independent Charge of the process fluid temperature to the wafer chuck inside +/- 0.1 °C of set level, plus the quickly response time on the method allows for optimum wafer-to-wafer repeatability all through the etch method.

With our unit strategically mounted close to six ft in the chamber, we realize a much more correct looking through on the chuck temperature. This tactic makes sure consistent temperature through the generation ton, bringing about enhanced wafer-to-wafer CD uniformity.

significant Footprint: Static units occupy important Area within the fabrication Instrument place, lessening its efficiency.

Dynamic Temperature Management, as applied in methods just like the LAUDA-Noah POU, is undoubtedly an approach that senses the temperature of the procedure fluid returning from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature in the supplied system fluid dependant on this real-time suggestions.

The data set Here's from the 200mm volume manufacturing wafer fab and Evidently illustrates the advantage of the LAUDA-Noah POU method.

The POU3300 process gives dynamic temperature control of the procedure chamber cathode / electrode / anode and may be synchronized with any etch method.

the truth is the fact that genuine Dynamic Temperature Handle can only be attained when all five (5) of the subsequent technique design and installation prerequisites are met:

(thus, setting up a static unit close to chamber will not help it to provide dynamic temperature Management)

We require much less cooling/heating potential for the same software being a static TCU because of our compact reservoir volume.